rev.1.00, aug.20.20 04, page 1 of 3 FS16VS-7A high-speed switching use nch power mos fet rej03g0276-0100 under development rev.1.00 aug.20.2004 features ? v dss : 350 v ? r ds(on) (max) : 0.35 ? ? i d : 16 a ? surface mount package (ldpak (s)-1) outline 1. gate 2. drain 3. source 4. drain ldpak(s)-1 1 2 3 4 1 3 2, 4 applications lamp ballast, switching mode power supply, plasma display, etc. maximum ratings (tc = 25c) parameter symbol ratings unit conditions drain-source voltage v dss 350 v v gs = 0 v gate-source voltage v gss 30 v v ds = 0 v drain current i d 16 a drain current (pulsed) i dm 48 a avalanche current (pulsed) i da 16 a l = 200 h maximum power dissipation p d 125 w channel temperature tch ? 55 to +150 c storage temperature tstg ? 55 to +150 c mass ? 1.3 g typical value
FS16VS-7A rev.1.00, aug.20.20 04, page 2 of 3 electrical characteristics (tch = 25c) parameter symbol min. typ. max. unit test conditions drain-source breakdown voltage v (br)dss 350 ? ? v i d = 1 ma, v gs = 0 v gate-source breakdown voltage v (br)gss 30 ? ? v i g = 100 a, v ds = 0 v gate-source leakage current i gss ?? 10 av gs = 25 v, v ds = 0 v drain-source leakage current i dss ?? 1mav ds = 350 v, v gs = 0 v gate-source threshold voltage v gs(th) 2.5 3.0 3.5 v i d = 1 ma, v ds = 10 v drain-source on-state resistance r ds(on) ? 0.27 0.35 ? i d = 8 a, v gs = 10 v drain-source on-state voltage v ds(on) ? 2.16 2.80 v i d = 8 a, v gs = 10 v forward transfer admittance | y fs | 6.0 13.0 ? s i d = 8 a, v ds = 10 v input capacitance ciss ? 1500 ? pf output capacitance coss ? 160 ? pf reverse transfer capacitance crss ? 40 ? pf v ds = 25 v, v gs = 10 v, f = 1mhz turn-on delay time t d(on) ?25?ns rise time t r ?45?ns turn-off delay time t d(off) ? 200 ? ns fall time t f ?55?ns v dd = 150 v, i d = 8 a, v gs = 10 v, r gen = r gs = 50 ? source-drain voltage v sd ?1.52.0 vi s = 8 a, v gs = 0 v thermal resistance rth(ch-c) ? ? 1.0 c/w channel to case switching time measurement circuit switching waveform t r t d(on) vin 90% 90% 10% 10% vout t d(off) 90% 10% t f vin monitor d.u.t. r l v dd vout monitor r gen r gs
FS16VS-7A rev.1.00, aug.20.20 04, page 3 of 3 package dimensions package code jedec jeita mass (reference value) ldpak (s)-(1) ? ? 1.30 g 10.2 0.3 1.37 0.2 (1.5) (1.4) 8.6 0.3 10.0 + 0.3 ? 0.5 4.44 0.2 1.3 0.15 0.1 + 0.2 ? 0.1 0.4 0.1 2.49 0.2 0.86 + 0.2 ? 0.1 2.54 0.5 2.54 0.5 1.3 0.2 3.0 + 0.3 ? 0.5 (1.5) 7.8 6.6 2.2 1.7 7.8 7.0 as of january, 2003 unit: mm order code lead form standard packing quantity standard order code standard order code example surface-mounted type taping 1000 type name ? t +direction (1 or 2) +1 FS16VS-7A-t11 note : please confirm the specificat ion about the shipping in detail.
keep safety first in your circuit designs! 1. renesas technology corp. puts the maximum effort into making semiconductor products better and more reliable, but there is a lways the possibility that trouble may occur with them. trouble with semiconductors may lead to personal injury, fire or property damage. remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placeme nt of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. notes regarding these materials 1. these materials are intended as a reference to assist our customers in the selection of the renesas technology corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to renesas t echnology corp. or a third party. 2. renesas technology corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. all information contained in these materials, including product data, diagrams, charts, programs and algorithms represents i nformation on products at the time of publication of these materials, and are subject to change by renesas technology corp. without notice due to product improvement s or other reasons. it is therefore recommended that customers contact renesas technology corp. or an authorized renesas technology corp. product distrib utor for the latest product information before purchasing a product listed herein. the information described here may contain technical inaccuracies or typographical errors. renesas technology corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies o r errors. please also pay attention to information published by renesas technology corp. by various means, including the renesas techn ology corp. semiconductor home page (http://www.renesas.com). 4. when using any or all of the information contained in these materials, including product data, diagrams, charts, programs, a nd algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. renesas technology corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. renesas technology corp. semiconductors are not designed or manufactured for use in a device or system that is used under ci rcumstances in which human life is potentially at stake. please contact renesas technology corp. or an authorized renesas technology corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerosp ace, nuclear, or undersea repeater use. 6. the prior written approval of renesas technology corp. is necessary to reprint or reproduce in whole or in part these materi als. 7. if these products or technologies are subject to the japanese export control restrictions, they must be exported under a lic ense from the japanese government and cannot be imported into a country other than the approved destination. any diversion or reexport contrary to the export control laws and regulations of japan and/or the country of destination is prohibited. 8. please contact renesas technology corp. for further details on these materials or the products contained therein. sales strategic planning div. nippon bldg., 2-6-2, ohte-machi, chiyoda-ku, tokyo 100-0004, japan http://www.renesas.com renesas technology america, inc. 450 holger way, san jose, ca 95134-1368, u.s.a tel: <1> (408) 382-7500 fax: <1> (408) 382-7501 renesas technology europe limited. dukes meadow, millboard road, bourne end, buckinghamshire, sl8 5fh, united kingdom tel: <44> (1628) 585 100, fax: <44> (1628) 585 900 renesas technology europe gmbh dornacher str. 3, d-85622 feldkirchen, germany tel: <49> (89) 380 70 0, fax: <49> (89) 929 30 11 renesas technology hong kong ltd. 7/f., north tower, world finance centre, harbour city, canton road, hong kong tel: <852> 2265-6688, fax: <852> 2375-6836 renesas technology taiwan co., ltd. fl 10, #99, fu-hsing n. rd., taipei, taiwan tel: <886> (2) 2715-2888, fax: <886> (2) 2713-2999 renesas technology (shanghai) co., ltd. 26/f., ruijin building, no.205 maoming road (s), shanghai 200020, china tel: <86> (21) 6472-1001, fax: <86> (21) 6415-2952 renesas technology singapore pte. ltd. 1, harbour front avenue, #06-10, keppel bay tower, singapore 098632 tel: <65> 6213-0200, fax: <65> 6278-8001 renesas sales offices ? 200 4. re nesas technology corp ., all rights reser v ed. printed in ja pan. colophon .1.0
|
